Smart Packaging
News and analysis on the latest smart packaging developments covering RFID, NFC, barcodes, UV, connected packaging traceability, and more.
Zero-deposit reuse system brings reusable containers to on-site foodservice
Reusables.com’s RFID-enabled, zero-deposit reuse system supplies reusable foodservice containers and smart return bins to university campuses,
‘Frictionless’ reuse system uses QR and avoids apps for simpler cup returns
Borro has developed a ‘frictionless’ reuse system for beverage cups served at events; its app-free, QR-driven return process
Waitrose tracks and traces plastic packaging waste with Polytag’s UV tags
Waitrose has become the newest member of Polytag’s Ecotrace Programme, which identifies and captures data on single-use plastic
REDYSIGN reports progress on recyclable-by-design and anti-spoilage packaging
The EU-funded REDYSIGN consortium - seeking to develop processes for producing and circularizing bio-based, recyclable, smart fibre-based packaging
Personalized Coca-Cola cans unlock interactive experiences with QR codes
Coca-Cola is reviving its Share a Coke campaign, in which consumers can scan an on-pack QR code to
EU funds semiconductor pilot line for European advanced packaging production
VTT Technical Research Centre of Finland reports that the Chips Joint Undertaking’s Public Authorities Board will award funding to
New platform transitions brands from barcodes into on-pack QR campaigns
Part of the Polytag Group, the newly launched QR Squared service creates and downloads on-pack Digital Link QR codes
India updates plastic waste rules for packaging traceability and compliance
India’s Ministry of Environment, Forest and Climate Change has amended its Plastic Waste Management Rules to mandate the provision
Copper-infused masterbatch to prevent food spoilage and extend shelf life
Copperprotek has developed a copper-infused masterbatch for the inner layer of food packaging, said to help preserve products and
Reusable smart label from Giesecke+Devrient unlocks IoT tracking and more
Giesecke+Devrient has revealed the reusable, ‘ultra-thin’ G+D Smart Label, which embeds IoT features into a package and
Amazon boxes devices with more recyclate, less ink, and tactile QR instructions
New, circularity-minded packaging designs for Amazon’s Echo, Kindle, and Fire TV products claim to use an average of
Semiconductor manufacturers receive government funding for U.S. production
In order to bolster semiconductor manufacturing in the United States, SkyWater Technology and Intel Corporation could receive combined investments of