On 5 June, the European Commission published a Commission Notice providing further clarity about the Packaging and Packaging Waste Regulation in practice. We take a closer look at the document to understand its requirements in detail, including the current status of PFAS restrictions, the…
In this Innovation Spotlight, Dow outlines how its extrusion coating portfolio aims to support recyclability requirements and regulatory readiness, and how its collaboration with RDM Group demonstrates how lightweight polymer coatings can extend the use of fibre-based packaging into applications…
With respect to the number of visitors and their quality the interpack trade fair, held from 4 to 10 May in Düsseldorf, showed excellent results for Sesotec GmbH.
Following the success of Interpack, which saw a strong interest in VOLPAK's horizontal pouching machines, the Spanish company, part of Coesia, is preparing for the challenges of the future with renewed optimism.
The depth and breadth of innovation at interpack was as overwhelming as ever. However, one particular trend stood out: 2017 was the year that Industry 4.0 truly arrived.
At interpack 2017, James Apap Bologna, VP Marketing and Corporate Communications at Intertape Polymer Group, talks to Packaging Europe about the company's solutions for the electronic fulfilment industry.
Simon Edwards, Vice President Sales & Marketing at Tonejet, talks to Packaging Europe about the company's new digital can decorating machine and how Rockwell's iTRAK technology is an ideal fit to enhance the machine's capabilities.
Theegarten-Pactec’s resumé of this year's interpack fair includes several successful contracts, numerous visitors and a high degree of internationality and professional expertise.
MULTIVAC is redefining thermoforming packaging with its X-line. The machine manufacturer from the Allgäu region showed at this machine for the first time at interpack 2017.
ACMA, a part of the Coesia group, has decades of experience in designing, building and selling automatic machinery for packaging consumer goods, and boasts a highly diversified portfolio of technological solutions.
The global biscuit and confectionery company pladis has signed a preferred supplier agreement with Bosch Packaging Technology at leading trade fair interpack 2017.
The second Global Flexible Packaging Executive Forum, held during interpack 2017 in Dusseldorf, attracted significantly increased numbers compared with the first event.
