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# Bostik unveils high-performance solvent-less laminating adhesive for retort applications
- URL: https://packaging-europe.ghost.io/bostik-unveils-high-performance-solvent-less-laminating-adhesive-for-retort-applications/
- Published: 2025-10-20T06:57:00.000Z
- Updated: 2025-10-23T14:57:00.000Z
- Author: Bostik
- Tags: Spotlight, #layout-s, #type-from-our-sponsors, #packaging-europe, #Import 2026-09-08 15:54

Bostik, a global leader in adhesive technologies, is proud to announce the launch of its new solvent-less laminating adhesive, specifically engineered for retort applications. This advanced adhesive solution is designed to withstand extreme conditions—up to 135°C for 1 hour—while delivering exceptional bond strength on challenging substrates such as aluminum foil, SiOx, and AlOx-coated films.

![VISUEL ADHESIVE 2](https://storage.ghost.io/c/61/60/61607b5b-1c0b-4249-a886-4bc4c284c107/content/images/d2wrwj382xgrci-cloudfront-net/Pictures/2000xany/2/3/8/18238_visueladhesive2_203841.jpg)

**Performance meets sustainability**

This aliphatic adhesive meets PAA-free requirements. It can be coated at just 2–2.5 g/m², contributing to the structure cost efficiency. Combined with its solvent-free formulation, this adhesive significantly lowers emissions during production, supporting converters in their sustainability goals.

**A value chain collaboration for circular packaging**

![VISUEL POUCH 2.png](https://storage.ghost.io/c/61/60/61607b5b-1c0b-4249-a886-4bc4c284c107/content/images/d2wrwj382xgrci-cloudfront-net/Pictures/2000xany/2/3/7/18237_visuelpouch2-png_97924.jpg)

At K Fair 2025, Bostik has introduced a mono-material PP retortable pouch developed in collaboration with key players across the packaging value chain:

· Nordmeccanica: Triplex 1 Shot Lamination equipment offering exceptional efficiency

· Toyo Ink: Water-based inks allowing low-emission printing

· Hyper Cast: Cast PP film providing structural integrity

· Toppan: Retortable high barrier film ensuring shelf-life and product protection

This pouch is designed with \*over 90% polypropylene (PP) content, fully aligned with CEFLEX guidelines for design for recycling. The combination of solvent-less adhesive and water-based ink ensures minimized emissions while maintaining high-performance standards.

[**Click here**](https://mkc.artiencegroup.com/en/collaborative%5Fpouch%5F1%5F2?ref=packaging-europe.ghost.io) to learn more about this pouch.

**Driving Innovation in Retort Packaging**

Bostik’s new adhesive solution empowers converters and brand owners to meet the dual challenge of technical performance and environmental responsibility. It enables high-speed lamination, excellent wet-out, and robust thermal resistance—making it ideal for ready meals and other demanding applications.

*“This launch is a testament to Bostik’s commitment to innovation and sustainability. By working closely with partners across the value chain, we’re delivering a solution that meets the highest standards of performance, recyclability, and environmental stewardship.” — Hervé Cavalié, Global Flex Director, Bostik*

**Visit Bostik at interpack 2026**

Join Bostik at interpack in Düsseldorf from 6th to 13th of May 2026 to explore the company’s broad portfolio and other innovative co-developments. Discover how smart chemistry can drive the future of sustainable packaging.

For more information, visit [bostik.com](https://www.bostik.com/?ref=packaging-europe.ghost.io) or contact your local Bostik representative.

**This content was sponsored by Bostik.**